General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.53 g/cm³ Show Supplier Material materials with Density of 1.53 g/cm³ | ISO 1183 |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 11.2 GPa Show Supplier Material materials with Elastic modulus of 11.2 GPa | ISO 527 | 1 mm/min |
Elongation | 23.0 °C | 1.9 % Show Supplier Material materials with Elongation of 1.9 % | ISO 527 | break, 5 mm/min |
Flexural modulus | 23.0 °C | 9.5 GPa Show Supplier Material materials with Flexural modulus of 9.5 GPa | ISO 178 | 2 mm/min |
Flexural strength | 23.0 °C | 222 MPa Show Supplier Material materials with Flexural strength of 222 MPa | ISO 178 | yield, 2 mm/min |
Impact strength, Izod notched | 23.0 °C | 9 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 9 kJ/m² | ISO 180/1A | notched 80*10*4, 23°C |
Impact strength, Izod unnotched | 23.0 °C | 40 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 40 kJ/m² | ISO 180/1U | 80*10*4, 23°C |
Tensile strength | 23.0 °C | 159 MPa Show Supplier Material materials with Tensile strength of 159 MPa | ISO 527 | break, 5 mm/min |
Technological properties
Property | ||
---|---|---|
Application areas | Electronic Components, Enclosures, Heavy Vehicles, Air Cabin Interiors, Oil/Gas | |
Availability | Europe,Americas | |
Processing methods | Mold Temperature: 140 to 165.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |