ULTEM™ Resin 9085 - Americas

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Description

High flow Polyetherimide blend. Meets FAR 25.853 and OSU 65/65 with low toxicity, smoke and flame evolution.

This material data has been provided by Sabic.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.34 g/cm³

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ISO 1183

Limiting oxygen index

23.0 °C

49 %

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Moisture absorption

23.0 °C

0.17 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.34 [-]

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ASTM D 792 |

Water absorption

23.0 °C

0.39 %

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ISO 62-1 | (23°C/saturated)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

3.05 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

50 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

2.75 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

90 MPa

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ISO 178 | yield, 2 mm/min

Impact strength, Izod notched

23.0 °C

13 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

115 J/m

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ASTM D 256

Tensile strength

23.0 °C

88 MPa

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ISO 527 | yield, 5 mm/min

Thermal

PropertyValueComment

Heat deflection temperature, 1.80 MPa

152 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Vicat softening temperature

173 °C

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ISO 306 | Rate B/120

Flammability

FAA Flammability, FAR 25.853 A/B: <5- FAR 25.853 <br> OSU peak heat release rate (5 minute test): 36kW/m² FAR 25.853 <br> Vertical Burn a (60s) passes at: 2sec FAR 25.853

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

8.9 g/10min

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ASTM D 1238 | 295°C/6.6 kgf

Melt volume-flow rate

40 cm³/10min

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ISO 1133 | MVR at 340°C/5.0 kg

Shrinkage

23.0 °C

0.5 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Fused Deposition Modeling (FDM), Electronics, Enclosures, Electronic Components, Air Cabin Interiors, Aircraft Seating, Aerospace, Audio, Displays, Document Handling, Composite, Non-LED Lighting, Photovoltaic Components, Wireless Communications

Availability

Europe,Asia,Americas

Features

High Stiffness, Hydrolytic Stability, Chemical Resistance, Low Smoke and Toxicity, Good Mechanicals in Broad Temperature Range, Low Creep Sensitivity, Low Shrinkage, Good metal adhesion, Amorphous, High Strength, High Heat Resistance, Good dimensional stability, Flame Retardant

Processing methods

Melt Temperature: 330 to 350.0°C
Nozzle Temperature: 330 to 350.0°C
Barrel - Zone 4 Temperature: 295 to 310.0°C
Middle - Zone 2 Temperature: 325 to 345.0°C
Barrel - Zone 2 Temperature: 280 to 295.0°C
Shot to Cylinder Size: 40 to 60.0%
Calibrator 2 Temperature: 80 to 120.0°C
Melt Temperature: 280 to 310.0°C
Rear - Zone 1 Temperature: 315 to 340.0°C
Front - Zone 3 Temperature: 330 to 350.0°C
Adapter Temperature: 270 to 310.0°C
Barrel - Zone 3 Temperature: 290 to 305.0°C
Screw Speed: 40 to 70.0rpm
Maximum Moisture Content: 0.02%
Drying Time: 4 to 6.0hrs
Back Pressure: 0.3 to 0.7MPa
Barrel - Zone 1 Temperature: 265 to 275.0°C
Drying Temperature: 135°C
Maximum Moisture Content: 0.02%
Die Temperature: 260 to 310.0°C
Drying Temperature: 120 to 130.0°C
Calibrator Temperature: 130 to 160.0°C
Vent Depth: 0.025 to 0.076mm
Mold Temperature: 120 to 150.0°C
Drying Time: 4 to 6.0hrs
Hopper Temperature: 80 to 100.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.