This website uses cookies to improve service quality. You will find more information about cookies on the privacy policy page.

Cu-HCP (SE-Cu) Oxygen free copper



Oxygen free copper grade

Equivalent Materials



Electrical conductivity σel

5.70E+7 S/m at 20 °C


Density ρ

8.9 g/cm³ at 20 °C


Elastic modulus E

127 GPa at 20 °C

Elongation A

5 - 45 % at 20 °C

hard - soft

Hardness, Brinell HB

45 - 95 [-] at 20 °C

Tensile strength Rm

200 - 360 MPa at 20 °C

Yield strength YS

50 - 320 MPa at 20 °C


Coefficient of thermal expansion α

1.77E-5 1/K at 20 °C

Thermal conductivity λ

386 W/(m·K) at 20 °C

This material data has been provided by Salomons Metalen.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.