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Cu-HCP (SE-Cu) Oxygen free copper Soft

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Description

Oxygen free copper grade

Equivalent Materials

Ashby charts

See where Cu-HCP (SE-Cu) Oxygen free copper Soft falls on the material property chart for Density against Elastic modulus in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

Properties

General

Density

ρ

8.9 g/cm³ at 20 °C

Thermal

Coefficient of thermal expansion

α

1.77E-5 1/K at 20 °C

Thermal conductivity

λ

386 W/(m·K) at 20 °C

Electrical

Electrical conductivity

σel

5.70E+7 S/m at 20 °C

Chemical properties

Element

Weight %

Comment

Cu

99.95 - 100 %

P

1E-3 - 5E-3 %

Do you need more data regarding this material?

This material data has been provided by Salomons Metalen.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.