Rubalit® 708HP C

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Description

Rubalit® 708 HP offers consistently reliable and convincing performance even when subject to high thermal and electrical loads in terms of its:

  • Thermocycling capability
  • Thermal shock resistance
  • Flexural strength
  • Surface quality
  • Thermal conductivity

    This makes Rubalit® 708 HP ideal for power electronics in conjunction with direct copper bonding (DCB) and active metal brazing (AMB).

  • This material data has been provided by CeramTec.

    "Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
    All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
    Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

    Ashby charts

    Properties

    General

    PropertyValueComment

    Density

    3.73 g/cm³

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    Surface roughness

    0.6 μm

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    as fired surface

    Water absorption

    0.1 %

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    Mechanical

    PropertyValueTesting StandardComment

    Flexural strength

    450 MPa

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    DR sigma 0

    0.63 mm thickness | rings 6 / 12 mm

    Thermal

    PropertyTemperatureValueComment

    Coefficient of thermal expansion

    6e-06 - 8e-06 1/K

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    100-200°C

    6e-06 - 8e-06 1/K

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    100-300°C

    6.7e-06 - 8.7e-06 1/K

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    100-600°C

    7e-06 - 9e-06 1/K

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    100-800°C

    Specific heat capacity

    20 °C

    0.7 J/(kg·K)

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    100 °C

    0.8 J/(kg·K)

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    Thermal conductivity

    20 °C

    22 W/(m·K)

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    Xe-flash | sample 16*16mm² | material specific thickness ≤ 3.5mm

    Electrical

    PropertyTemperatureValueFrequencyComment

    Dielectric constant

    8.3 - 11.3 [-]

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    1 GHz, 10 MHz, 100 MHz

    2mm thickness | Ra ≤ 0.4μm

    Dielectric strength

    15 kV/mm

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    min. | 0.635 mm thickness

    Dissipation factor

    0.01 [-]

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    1 GHz, 10 MHz, 100 MHz

    max. | 2mm thickness | Ra ≤ 0.4μm

    Electrical resistivity

    20 °C

    1e+11 Ω·m

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    200 °C

    1e+09 Ω·m

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    400 °C

    1e+07 Ω·m

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    600 °C

    100000 Ω·m

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    800 °C

    100000 Ω·m

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    Technological properties

    Property
    Chemical composition

    The material main component is Al₂O₃ with 96% content. Residue mainly consists of MgO, SiO2 and CaO and traces of other elements.