Polyphthalamide (PPA) HT01 GFR 30 BK Q1D001

Alternative and trade names
PA6T/6I/66-GF30
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Description

Partially Aromatic copolyamide with a combination of semi-crystalline polyamide reinforced with 30% Glass fiber, heat stabilized and lubricated for injection molding process.

Eplamid HT01 grades offer the following unique properties in general conditions, and even after moisture absorption: Good Surface Finish, Good Dimensional Stability, Good High Temperature Properties, Good Chemical Resistance to Glycols and Oils and Exellent Creep Resistance. Eplamid HT01 grades are used for molding technical parts where higher operating temperatures and higher stiffness in moist environments are required.

This material data has been provided by Epsan.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.42 g/cm³

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ISO 1183

Water content

23.0 °C

0.1 %

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ISO 15512

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

11.5 GPa

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ISO 527-2 (1mm/min)

Elongation

23.0 °C

3 %

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ISO 527-2 (5mm/min)

Hardness, Ball Indentation

23.0 °C

270 MPa

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ISO 2039-1

Impact strength, Charpy notched

-30.0 °C

9 kJ/m²

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ISO 179/1eA

23.0 °C

9 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

23.0 °C

50 kJ/m²

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ISO 179/1eU

Tensile strength

23.0 °C

195 MPa

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ISO 527-2 (5mm/min)

Thermal

PropertyTemperatureValueComment

Ash content

23.0 °C

30 %

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ISO 3451-4

Heat deflection temperature, 1.80 MPa

290 °C

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ISO 75-2/A

Heat deflection temperature, 8.0 MPa

200 °C

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ISO 75-2/B

Max service temperature, long

140 °C

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ISO 2578

Max service temperature, short

270 °C

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ISO 2578

Melting point

325 °C

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ISO 3146

Flammability

UL94 (0.8mm) HB

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

600 V

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EN 60112

Dielectric strength

23.0 °C

35 kV/mm

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IEC 60243-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.1 %

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ISO 294-4 (3mm)

Shrinkage, transverse

23.0 °C

0.6 %

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ISO 294-4 (3mm)

Technological properties

Property
Application areas

Eplamid HT01 grades are used for molding technical parts where higher operating temperatures and higher stiffness in moist environments are required.

Fillers

30% Glass Fiber

Other

Laboratory conditions are 23 ±2°C and 45-55 % RH.