Polyphthalamide (PPA) HT03 GFR 60 BK Q1G001

Alternative and trade names
PA66/6I/X-GF60
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Description

Partially Aromatic copolyamide with a combination of semi-crystalline polyamide reinforced with 60% Glass fiber, heat stabilized and lubricated for injection molding process.

Eplamid HT03 grades offer the following unique properties in general conditions, and even after moisture absorption: Good Surface Finish, Good Dimensional Stability, Good High Temperature Properties, Good Chemical Resistance to Glycols and Oils and Excellent Creep Resistance. Eplamid HT03 grades are used for molding technical parts where higher operating temperatures and higher stiffness in moist environments are required.

This material data has been provided by Epsan.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyValueTemperatureComment

Density

1.7 g/cm³

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23.0 °C

ISO 1183

Water content

0.1 %

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23.0 °C

ISO 15512

Mechanical

PropertyValueTemperatureComment

Elastic modulus

22.1 GPa

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23.0 °C

ISO 527-2 (1mm/min)

Elongation

2 %

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23.0 °C

ISO 527-2 (5mm/min)

Hardness, Ball Indentation

280 MPa

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23.0 °C

ISO 2039-1

Impact strength, Charpy notched

13 kJ/m²

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-30.0 °C

ISO 179/1eA

14 kJ/m²

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23.0 °C

ISO 179/1eA

Impact strength, Charpy unnotched

90 kJ/m²

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23.0 °C

ISO 179/1eU

Tensile strength

260 MPa

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23.0 °C

ISO 527-2 (5mm/min)

Thermal

PropertyValueTemperatureComment

Ash content

60 %

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23.0 °C

ISO 3451-4

Flammability

UL94 (0.8mm) HB

Heat deflection temperature, 1.80 MPa

235 °C

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ISO 75-2/A

Heat deflection temperature, 8.0 MPa

180 °C

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ISO 75-2/B

Max service temperature, long

110 °C

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ISO 2578

Max service temperature, short

215 °C

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ISO 2578

Melting point

260 °C

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ISO 3146

Electrical

PropertyValueTemperatureComment

Comparative tracking index

600 V

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23.0 °C

EN 60112

Dielectric strength

33 kV/mm

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23.0 °C

IEC 60243-1

Rheological Properties

PropertyValueTemperatureComment

Shrinkage

0.1 %

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23.0 °C

ISO 294-4 (3mm)

Shrinkage, transverse

0.3 %

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23.0 °C

ISO 294-4 (3mm)

Technological properties

Property
Application areas

Eplamid HT03 grades are used for molding technical parts where higher operating temperatures and higher stiffness in moist environments are required.

Fillers

60% Glass Fiber

Other

Laboratory conditions are 23 ±2°C and 45-55 % RH.