General
Property | Temperature | Value |
---|---|---|
Density | 23.0 °C | 5.4 g/cm³ Show Supplier Material materials with Density of 5.4 g/cm³ |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 260 GPa Show Supplier Material materials with Elastic modulus of 260 GPa | |
Hardness, Vickers | 23.0 °C | 1130 [-] Show Supplier Material materials with Hardness, Vickers of 1130 [-] | |
Plane-Strain Fracture Toughnes | 23.0 °C | 10 MPa·√m Show Supplier Material materials with Plane-Strain Fracture Toughnes of 10 MPa·√m | SENVB |
Weibull modulus | 23.0 °C | 16.8 [-] Show Supplier Material materials with Weibull modulus of 16.8 [-] |
Thermal
Property | Temperature | Value |
---|---|---|
Coefficient of thermal expansion | 23.0 °C | 9.3E-6 1/K Show Supplier Material materials with Coefficient of thermal expansion of 9.3E-6 1/K |
Thermal conductivity | 23.0 °C | 10 W/(m·K) Show Supplier Material materials with Thermal conductivity of 10 W/(m·K) |
Technological properties
Property | ||
---|---|---|
Application areas | Typical application areas include: Structural applications with high loading conditions | |
Other | The synthesis and processing of this composition is a patented procedure (patent no WO2011/015697 A1) |