ForTii® LDS51B

Alternative and trade names
PPA-GF30 FR(40)
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Description

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.

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ForTii® LDS51B

This material data has been provided by DSM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyValueConditionTesting Standard

Density

1.58 g/cm³

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dry

ISO 1183

Moisture absorption

1.3 %

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dry

Sim. to ISO 62

Water absorption

3.3 %

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dry

Sim. to ISO 62

Mechanical

PropertyTemperatureValueConditionTesting StandardThicknessComment

Elastic modulus

11.5 GPa

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dry

ISO 527-1/-2

11.5 GPa

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dry

ISO 527-1/-2

1 mm

11.8 GPa

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conditioned

ISO 527-1/-2

11.8 GPa

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conditioned

ISO 527-1/-2

120 °C

6 GPa

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dry

ISO 527-1/-2

160 °C

3.1 GPa

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dry

ISO 527-1/-2

Elongation

1.6 %

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dry, conditioned

ISO 527-1/-2

1.6 %

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dry, conditioned

ISO 527-1/-2

1 mm

120 °C

3 %

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dry

ISO 527-1/-2

160 °C

5 %

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dry

ISO 527-1/-2

Flexural modulus

11.3 GPa

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dry

ISO 178

11.6 GPa

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conditioned

ISO 178

120 °C

6.4 GPa

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dry

ISO 178

160 °C

3.6 GPa

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dry

ISO 178

Flexural yield strength

150 MPa

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conditioned

ISO 178

165 MPa

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dry

ISO 178

120 °C

90 MPa

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dry

ISO 178

160 °C

60 MPa

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dry

ISO 178

Impact strength, Charpy notched

23 °C

3 kJ/m²

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dry, conditioned

ISO 179/1eA

Impact strength, Charpy unnotched

23 °C

26 kJ/m²

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dry, conditioned

ISO 179/1eU

Tensile strength

100 MPa

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conditioned

ISO 527-1/-2

100 MPa

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conditioned

ISO 527-1/-2

at low thickness

110 MPa

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dry

ISO 527-1/-2

110 MPa

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dry

ISO 527-1/-2

1 mm

at low thickness

120 °C

57.0 MPa

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dry

ISO 527-1/-2

160 °C

37 MPa

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dry

ISO 527-1/-2

Thermal

PropertyValueConditionTesting StandardPressureComment

Coefficient of thermal expansion

3e-07 1/K

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dry

ASTM D696

Parallel

4e-07 1/K

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dry

ASTM D696

Normal

Glass transition temperature

125 °C

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dry

ISO 11357-1/-2

10°C/min

Heat deflection temperature

290 °C

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dry

ISO 75-1/-2

2 MPa

310 °C

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dry

ISO 75-1/-2

0.45 MPa

Melting point

325 °C

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dry

ISO 11357-1/-3

10°C/min

Electrical

PropertyValueConditionTesting StandardComment

Comparative tracking index

400 V

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dry

IEC 60112

Dielectric constant

4.06 [-]

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dry

IEC 60250

5GHz

4.12 [-]

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conditioned

IEC 60250

5GHz

4.13 [-]

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dry

IEC 60250

1GHz

4.23 [-]

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conditioned

IEC 60250

1GHz

Dissipation factor

165 [-]

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dry

IEC 60250

5GHz

182 [-]

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conditioned

IEC 60250

5GHz

210 [-]

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dry

IEC 60250

1GHz

217 [-]

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conditioned

IEC 60250

1GHz

Surface resistivity

1e+15 Ω/sq

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conditioned

IEC 62631-3-2

Volume resistivity

1e+13 Ω·cm

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dry, conditioned

IEC 62631-3-1

Rheological Properties

PropertyValueConditionTesting StandardComment

Shrinkage

0.3 %

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dry

ISO 294-4

Parallel

1 %

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dry

ISO 294-4

Normal

Technological properties

Property
Certifications

Yellow Card Available

Fillers

30% Glass Fiber