2.7 - 3 g/cm³
Show Supplier Material materials with Density of 2.7 - 3 g/cm³ at 23.0 °C
150 - 330 GPa
Show Supplier Material materials with Elastic modulus of 150 - 330 GPa at 23.0 °C
0.01 - 0.05 GPa
Show Supplier Material materials with Flexural modulus of 0.01 - 0.05 GPa at 23.0 °C
130 - 350 MPa
Show Supplier Material materials with Flexural strength of 130 - 350 MPa at 23.0 °C
Coefficient of thermal expansion
2.9E-6 - 3.5E-6 1/K
Show Supplier Material materials with Coefficient of thermal expansion of 2.9E-6 - 3.5E-6 1/K at 200.0 °C
Max service temperature, inert
Show Supplier Material materials with Max service temperature, inert of 1400 °C
in non-oxidizing environments
110 - 160 W/(m·K)
Show Supplier Material materials with Thermal conductivity of 110 - 160 W/(m·K) at 23.0 °C
Application examples for SIGRASIC®: NASA sensor carrier designed for low weight, high precision and high stiffness; pump impeller for highly corrosive and abrasive media; (high performance) clutch disk mass produced for cars/vehicles with excellent wear and strength properties; ballistic protection with complex shaped designs and high hardness.
Technical properties are customizable for individual purposes, base materials can be designed with the relevant content and type of carbon fibers.
C/SiC is manufactured by infiltrating a carbon fiber-reinforced carbon body with silicon. Due to near net shape processing, complex machining can be performed cost-effectively early in the process. Final ceramic grinding can be used locally when tight tolerances are required. By suitable adjustment of the material and process parameters, the product characteristics can be matched to the intended use of the SIGRASIC component.