Wärmeleitfähigkeit: 0.35 W/(m·K)

Quick Comparison

Polyamide 4T (PA4T)

ForTii® Eco E11

Geliefert von:

DSM Engineering Materials

Other Polyamide (PA)

Zytel® HTN54G35HSLR NC010

Polyphenylsulphon (PPSU)

Radel® R-5100

Polyetheretherketon (PEEK)

Polyetheretherketone Reinforced with 30% Glass Fibre (PEEK+GF30)

Geliefert von:

1 Matmatch-Lieferant

Polyamide 66 (PA66)

Polyamide 66 Reinforced with 50% Glass Fibers (PA66+GF50)

Geliefert von:

4 Matmatch-Lieferanten

Polyethylen niedriger Dichte (PE-LD)

Low Density Polyethylene (LDPE)

Geliefert von:

1 Matmatch-Lieferant

Polyphenylsulphon (PPSU)

Polyphenylene sulfone (PPSU)

Geliefert von:

1 Matmatch-Lieferant

Thermoplastisches Polyurethan (TPU)

Urethane thermoplastic elastomer (TPU)

Ethylen-Vinylacetat (EVA)

Ethylene vinyl acetate (EVAC)

Geliefert von:

1 Matmatch-Lieferant

Polyglycolsäure (PGA)

Polyglycolic acid (PGA)
Seite 1 von 2