PermaSOL™ 33-3

Alternative and trade names
High preformance polymer
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Description

A high temperature thermoset solution with low dielectric constant, high chemical resistance, high adhesion to various substrates, room temperature adhesion, no material movement and thermally curable.

This material data has been provided by Brewer Science.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.02 g/cm³

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Exact value: 1.01666

Mechanical

PropertyTemperatureValue

Elastic modulus

23.0 °C

3.4 GPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

4.5E-5 1/K

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Glass transition temperature

100 °C

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max.

Max service temperature

300 °C

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decomposition temperature

Electrical

PropertyTemperatureValue

Dielectric constant, 10GHz

23.0 °C

2.7 [-]

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Technological properties

Property
Application areas

High temperature adhesives and bonding. High temperature dielectric