OptiStack® PL700

Alternative and trade names
High performance polymer
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spin-on thermoset material solution, with a high carbon content, planarization properties

This material data has been provided by Brewer Science.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts




Coefficient of thermal expansion

23.0 °C

1.78E-4 - 5.77E-4 1/K

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respectively for below and above Tg

Glass transition temperature

110 °C

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Max service temperature

350 °C

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Technological properties

Application areas

Surface Planarization, High Temperature Gap fill, Spin-on Carbon, High temperature thermoset, Semiconductor Industry, Aerospace, Automotive, Packaging, Electronic Packaging