OptiStack® PL700

Alternative and trade names
High performance polymer

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Description

spin-on thermoset material solution, with a high carbon content, planarization properties

This material data has been provided by Brewer Science.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	1.78E-4 - 5.77E-4 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.78E-4 - 5.77E-4 1/K	respectively for below and above Tg
Glass transition temperature		110 °C Show Supplier Material materials with Glass transition temperature of 110 °C
Max service temperature		350 °C Show Supplier Material materials with Max service temperature of 350 °C

Technological properties

Property
Application areas	Surface Planarization, High Temperature Gap fill, Spin-on Carbon, High temperature thermoset, Semiconductor Industry, Aerospace, Automotive, Packaging, Electronic Packaging

OptiStack® PL700

Description

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Applications

Materials by this supplier

Use cases

Properties