TECACOMP PA66 TC white 3924

Alternative and trade names
PA66-GF30
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Description

PA 66 (Polyamide 66) reinfoced with glass fiber and ceramics. Main features: high thermal conductivity and very good electrical insulation

This material data has been provided by Ensinger GmbH.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Bulk density

23.0 °C

0.79 g/cm³

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EN ISO 60

Density

23.0 °C

1.51 g/cm³

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Water absorption

23.0 °C

1.3 %

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DIN EN ISO 62, 23 °C / 50 % relative humidity up to saturation

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

13 GPa

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DIN EN ISO 527-1, 50mm/min

Elongation

23.0 °C

1.5 %

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DIN EN ISO 527-1, 50mm/min

Impact strength, Charpy unnotched

23.0 °C

25 kJ/m²

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DIN EN ISO 179-1eU

Tensile strength

23.0 °C

105 MPa

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DIN EN ISO 527-1, 50mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

34.0 °C

2.5E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 34±11°C, 95±25°C

95.0 °C

2.5E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 34±11°C, 95±25°C

Coefficient of thermal expansion, transverse

34.0 °C

5E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 34±11°C, 95±25°C

95.0 °C

7.5E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 34±11°C, 95±25°C

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Glass transition temperature

50 °C

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DIN 53765

Heat deflection temperature, 1.80 MPa

252 °C

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ISO-R 75 Method A

Max service temperature, long

120 °C

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Max service temperature, short

180 °C

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Melting point

255 °C

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DIN 53765

Specific heat capacity

23.0 °C

1090 J/(kg·K)

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DIN EN 821

Thermal conductivity, in-plane

23.0 °C

3.5 W/(m·K)

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DIN EN 821

Thermal conductivity, through-plane

23.0 °C

1.5 W/(m·K)

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DIN EN 821

Thermal diffusivity, in-plane

23.0 °C

1.6 mm²/s

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DIN EN 821

Thermal diffusivity, through-plane

23.0 °C

0.7 mm²/s

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DIN EN 821

Flammability

UL94 class HB, DIN IEC 60695-11-10

Electrical

PropertyTemperatureValueComment

Surface resistivity

23.0 °C

5.00E+12 Ω/sq

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DIN EN 61340-2-3

Volume resistivity

23.0 °C

3.60E+12 Ω·cm

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DIN EN 61340-2-3

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

40 g/10min

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DIN EN ISO 1133, 280°C/5kg

Melt volume-flow rate

26.5 cm³/10min

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DIN EN ISO 1133, 280°C/5kg

Shrinkage

23.0 °C

0.36 %

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DIN EN ISO 294-4

Shrinkage, transverse

23.0 °C

0.67 %

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DIN EN ISO 294-4

Technological properties

Property
Application areas

Electrical engineering, LED lighting technology, Mechanical engineering, Automotive industry

camera, moulded interconnect device (PCB, LDS), power distribution in electronics and radar

Color

White

Detectability

Fillers

Glass Fiber and Ceramic

Processing methods

Permissible residual moisture content (%): , drying temperature (°C): 80, drying time (h): 5, mould temperature (°C): 150, material temperature (°C): , cylinder/processing temperature (°C): 295