TECACOMP PA66 TC black 4028

Alternative and trade names
PA66-GF
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Description

PA 66 (Polyamide 66) filled with graphite adn glass fiber. Main features: high thermal conductivity , electrically conductive

Equivalent Materials

This material data has been provided by Ensinger GmbH.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyValueTesting StandardComment

Bulk density

0.6 g/cm³

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EN ISO 60

Density

1.49 g/cm³

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Water absorption

1.5 %

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DIN EN ISO 62

23°C | 50 % r.h. up to saturation

Mechanical

PropertyValueTesting StandardComment

Elastic modulus

11.4 GPa

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DIN EN ISO 527-1

50 mm/min

Elongation

1.5 %

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DIN EN ISO 527-1

50 mm/min

Impact strength, Charpy unnotched

20 kJ/m²

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DIN EN ISO 179-1eU

Tensile strength

90 MPa

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DIN EN ISO 527-1

50 mm/min

Thermal

PropertyValueTesting StandardPressureComment

Coefficient of thermal expansion

2.3e-05 1/K

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DIN EN ISO 11359-1/2

at 23-45°C

2.6e-05 1/K

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DIN EN ISO 11359-1/2

at 70-120°C

5e-05 1/K

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DIN EN ISO 11359-1/2

at 23-45°C, Transverse

7.3e-05 1/K

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DIN EN ISO 11359-1/2

at 70-120°C, Transverse

Glass transition temperature

50 °C

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DIN 53765

Heat deflection temperature

250 °C

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ISO-R 75 Method A

1.8 MPa

Max service temperature

120 °C

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Long

180 °C

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Short

Melting point

255 °C

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DIN 53765

Specific heat capacity

1120 J/(kg·K)

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DIN EN 821

Thermal conductivity

1.6 W/(m·K)

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DIN EN 821

through-plane

5.8 W/(m·K)

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DIN EN 821

in-plane

Thermal diffusivity

0.9 mm²/s

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DIN EN 821

through-plane

3.4 mm²/s

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DIN EN 821

in-plane

Flammability

UL94 class HB, DIN IEC 60695-11-10

Electrical

PropertyValueTesting Standard

Surface resistivity

2.5e+06 Ω/sq

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DIN EN 61340-2-3

Volume resistivity

9.3e+06 Ω·cm

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DIN EN 61340-2-3

Rheological Properties

PropertyValueTesting StandardComment

Melt mass-flow rate

12.5 g/10min

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DIN EN ISO 1133

280°C/2.16kg

Melt volume-flow rate

10 cm³/10min

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DIN EN ISO 1133

280°C/2.16kg

Shrinkage

0.4 %

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DIN EN ISO 294-4

0.98 %

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DIN EN ISO 294-4

Transverse

Technological properties

Property
Application areas

Electrical engineering , Mechanical engineering , Automotive industry

camera, moulded interconnect device (PCB, LDS), power distribution in electronics and radar

Color

Black

Fillers

Glass Fiber and Graphite

Processing methods

Drying temperature (°C): 80, drying time (h): 5, mould temperature (°C): 150, material temperature (°C): , cylinder/processing temperature (°C): 295