TECACOMP PEEK TC black 1054135

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Equivalent Materials

This material data has been provided by Ensinger GmbH.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyValueTesting Standard

Bulk density

0.8 g/cm³

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EN ISO 60

Water absorption

0.02 %

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Mechanical

PropertyValueTesting Standard

Elastic modulus

10.5 GPa

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DIN EN ISO 527-1

Elongation

2 %

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DIN EN ISO 527-1

Impact strength, Charpy unnotched

15 kJ/m²

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DIN EN ISO 179-1eU

Tensile strength

86 MPa

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DIN EN ISO 527-1

Thermal

PropertyValueTesting StandardPressureComment

Coefficient of thermal expansion

1.6e-05 1/K

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DIN EN ISO 11359-1/2

at 23-100°C

2.2e-05 1/K

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DIN EN ISO 11359-1/2

at 23-100°C, Transverse

5.1e-05 1/K

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DIN EN ISO 11359-1/2

at 200-260°C

6.7e-05 1/K

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DIN EN ISO 11359-1/2

at 200-260°C, Transverse

8.5e-05 1/K

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DIN EN ISO 11359-1/2

at 260 - 285°C

8.5e-05 1/K

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DIN EN ISO 11359-1/2

at 260-285°C, Transverse

Glass transition temperature

143 °C

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Heat deflection temperature

264 °C

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ISO-R 75 Method A

1.8 MPa

Max service temperature

300 °C

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Short

Melting point

343 °C

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Specific heat capacity

1050 J/(kg·K)

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DIN EN 821

Thermal conductivity

1.3 W/(m·K)

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DIN EN 821

through-plane

5 W/(m·K)

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DIN EN 821

in-plane

Thermal diffusivity

0.8 mm²/s

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DIN EN 821

through-plane

3.2 mm²/s

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DIN EN 821

in-plane

Flammability

UL94 class V0 for 0.8 and 1.6mm thickness, DIN IEC 60695-11-10

Electrical

PropertyValueTesting Standard

Surface resistivity

6.3e+07 Ω/sq

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DIN EN 61340-2-3

Volume resistivity

1.4e+08 Ω·cm

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DIN EN 61340-2-3

Rheological Properties

PropertyValueTesting StandardComment

Melt mass-flow rate

21 g/10min

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DIN EN ISO 1133

380°C/10kg

Shrinkage

0.48 %

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DIN EN ISO 294-4

0.57 %

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DIN EN ISO 294-4

Transverse

Technological properties

Property
Application areas

camera, moulded interconnect device (PCB, LDS), power distribution in electronics and radar

Color

Black

Processing methods

Permissible residual moisture content (%): 0.02, drying temperature (°C): 140-160, drying time (h): 4-6, mould temperature (°C): 160-210, material temperature (°C): 390-400, cylinder/processing temperature (°C): 360-400