TECACOMP PPA LDS black 4108

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Description

PPA (Polyphtalamide) developed for the LPKF-LDS® process with high thermal conductivity

This material data has been provided by Ensinger GmbH.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.96 g/cm³

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Water absorption

23.0 °C

0.1 %

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DIN EN ISO 62, 23 °C / 50 % relative humidity up to saturation

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

8.3 GPa

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DIN EN ISO 527-1

Elongation

23.0 °C

1.6 %

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DIN EN ISO 527-1

Impact strength, Charpy unnotched

23.0 °C

14 kJ/m²

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DIN EN ISO 179-1eU

Tensile strength

23.0 °C

77 MPa

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DIN EN ISO 527-1

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

75.0 °C

4.3E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 75±25°C, 125±25°C, 175±25°C

125.0 °C

6.2E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 75±25°C, 125±25°C, 175±25°C

175.0 °C

9.7E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 75±25°C, 125±25°C, 175±25°C

Coefficient of thermal expansion, transverse

75.0 °C

4.7E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 75±25°C, 125±25°C, 175±25°C

125.0 °C

7.1E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 75±25°C, 125±25°C, 175±25°C

175.0 °C

1.12E-4 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 75±25°C, 125±25°C, 175±25°C

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Glass transition temperature

140 °C

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DIN 53765

Heat deflection temperature, 1.80 MPa

237 °C

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ISO-R 75 Method A

Max service temperature, long

150 °C

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Max service temperature, short

250 °C

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Melting point

315 °C

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DIN 53765

Specific heat capacity

23.0 °C

900 J/(kg·K)

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DIN EN 821

Thermal conductivity, in-plane

23.0 °C

0.9 W/(m·K)

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DIN EN 821

Thermal conductivity, through-plane

23.0 °C

1.2 W/(m·K)

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DIN EN 821

Thermal diffusivity, in-plane

23.0 °C

0.68 mm²/s

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DIN EN 821

Thermal diffusivity, through-plane

23.0 °C

0.51 mm²/s

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DIN EN 821

Flammability

UL94 class HB for 1.6 and 3.2mm thickness, , DIN IEC 60695-11-10

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

550 V

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DIN EN 60112

Surface resistivity

23.0 °C

2.35E+15 Ω/sq

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DIN EN 61340-2-3

Volume resistivity

23.0 °C

3.60E+16 Ω·cm

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DIN EN 61340-2-3

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

86.7 g/10min

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DIN EN ISO 1133, 330°C/5kg

Shrinkage

23.0 °C

1.67 %

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DIN EN ISO 294-4

Shrinkage, transverse

23.0 °C

1.45 %

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DIN EN ISO 294-4

Technological properties

Property
Application areas

Electrical engineering, LED lighting technology, Mechanical engineering, Automotive industry

camera, moulded interconnect device (PCB, LDS), power distribution in electronics and radar

Color

Black

Detectability

Processing methods

Permissible residual moisture content (%): 0.1, drying temperature (°C): 100, drying time (h): 3, mould temperature (°C): 170, material temperature (°C): 330, cylinder/processing temperature (°C): 340

Surface Finish

Laser Marking Parameter- Power: 2-6W - Frequency: 100-200 kHz - Forw ard movement: 2-3 m/s