TECACOMP PEEK LDS black 1047045

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Description

PEEK (Polyetheretherketone) filled with mineral powder developed for the LPKF-LDS® process

This material data has been provided by Ensinger GmbH.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Bulk density

23.0 °C

0.9 g/cm³

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EN ISO 60

Density

23.0 °C

1.67 g/cm³

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Water absorption

23.0 °C

0.1 %

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max., DIN EN ISO 62, 23 °C / 50 % relative humidity up to saturation

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

10.9 GPa

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DIN EN ISO 527-1, 50mm/min

Elongation

23.0 °C

2.5 %

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DIN EN ISO 527-1, 50mm/min

Impact strength, Charpy unnotched

23.0 °C

35 kJ/m²

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DIN EN ISO 179-1eU

Tensile strength

23.0 °C

105 MPa

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DIN EN ISO 527-1, 50mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

61.5 °C

1.8E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 61.5±38.5°C, 230±30°C, 280±20°C

230.0 °C

4.6E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 61.5±38.5°C, 230±30°C, 280±20°C

280.0 °C

6.3E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 61.5±38.5°C, 230±30°C, 280±20°C

Coefficient of thermal expansion, transverse

61.5 °C

2.6E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 61.5±38.5°C, 230±30°C, 280±20°C

230.0 °C

6.7E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 61.5±38.5°C, 230±30°C, 280±20°C

280.0 °C

8.8E-5 1/K

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DIN EN ISO 11359-1;2, values applicable for the range 61.5±38.5°C, 230±30°C, 280±20°C

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Glass transition temperature

143 °C

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DIN 53765

Heat deflection temperature, 1.80 MPa

218 °C

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ISO-R 75 Method A

Max service temperature, long

260 °C

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Max service temperature, short

300 °C

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Melting point

343 °C

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DIN 53765

Specific heat capacity

23.0 °C

970 J/(kg·K)

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DIN EN 821

Thermal conductivity, in-plane

23.0 °C

1.7 W/(m·K)

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DIN EN 821

Thermal conductivity, through-plane

23.0 °C

0.5 W/(m·K)

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DIN EN 821

Thermal diffusivity, in-plane

23.0 °C

1 mm²/s

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DIN EN 821

Thermal diffusivity, through-plane

23.0 °C

0.28 mm²/s

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DIN EN 821

Flammability

UL94 class V0, DIN IEC 60695-11-10

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

225 V

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DIN EN 60112

Dielectric constant, 1KHz

23.0 °C

3.73 [-]

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DIN 53483-1

Dielectric strength

23.0 °C

17.5 kV/mm

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ISO 60243-1

Loss factor

23.0 °C

6.6E-3 [-]

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DIN 53483-1, 1KHz

Surface resistivity

23.0 °C

5.80E+12 Ω/sq

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DIN EN 61340-2-3

Volume resistivity

23.0 °C

5.80E+12 Ω·cm

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DIN EN 61340-2-3

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

77 g/10min

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DIN EN ISO 1133, 380°C/10kg

Shrinkage

23.0 °C

0.52 %

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DIN EN ISO 294-4

Shrinkage, transverse

23.0 °C

0.56 %

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DIN EN ISO 294-4

Technological properties

Property
Application areas

Automotive industry, Mechanical engineering and Medical technology

camera, moulded interconnect device (PCB, LDS), power distribution in electronics and radar

Color

Black

Detectability

Fillers

Mineral Powder

Processing methods

Permissible residual moisture content (%): 0.02, drying temperature (°C): 160, drying time (h): 6, mould temperature (°C): 210, material temperature (°C): 400, cylinder/processing temperature (°C): 400

Surface Finish

Laser Marking Parameter- Power: 2-8W - Frequency: 120-180 kHz - Forw ard movement: 1.8-2.4 m/s