General
Property | Value | Testing Standard | Comment |
---|---|---|---|
Bulk density | 0.97 g/cm³ Show Supplier Material materials with Bulk density of 0.97 g/cm³ | EN ISO 60 | |
Density | 1.74 g/cm³ Show Supplier Material materials with Density of 1.74 g/cm³ | ||
Water absorption | 0.1 % Show Supplier Material materials with Water absorption of 0.1 % | DIN EN ISO 62 | max. | 23°C | 50 % r.h. up to saturation |
Mechanical
Property | Value | Testing Standard |
---|---|---|
Elastic modulus | 9.7 GPa Show Supplier Material materials with Elastic modulus of 9.7 GPa | DIN EN ISO 527-1 |
Elongation | 1.6 % Show Supplier Material materials with Elongation of 1.6 % | DIN EN ISO 527-1 |
Impact strength, Charpy unnotched | 15 kJ/m² Show Supplier Material materials with Impact strength, Charpy unnotched of 15 kJ/m² | DIN EN ISO 179-1eU |
Tensile strength | 85 MPa Show Supplier Material materials with Tensile strength of 85 MPa | DIN EN ISO 527-1 |
Thermal
Property | Value | Testing Standard | Pressure | Comment | |||
---|---|---|---|---|---|---|---|
Coefficient of thermal expansion | 8e-06 1/K Show Supplier Material materials with Coefficient of thermal expansion of 8e-06 1/K | DIN EN ISO 11359-1/2 | at 50-100°C | ||||
1.1e-05 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.1e-05 1/K | DIN EN ISO 11359-1/2 | at 100-150°C | |||||
1.3e-05 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.3e-05 1/K | DIN EN ISO 11359-1/2 | at 200-250°C | |||||
1.4e-05 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.4e-05 1/K | DIN EN ISO 11359-1/2 | at 150-200°C | |||||
3.4e-05 1/K Show Supplier Material materials with Coefficient of thermal expansion of 3.4e-05 1/K | DIN EN ISO 11359-1/2 | at 50-100°C, Transverse | |||||
4.4e-05 1/K Show Supplier Material materials with Coefficient of thermal expansion of 4.4e-05 1/K | DIN EN ISO 11359-1/2 | at 100-150°C, Transverse | |||||
5.3e-05 1/K Show Supplier Material materials with Coefficient of thermal expansion of 5.3e-05 1/K | DIN EN ISO 11359-1/2 | at 150-200°C, Transverse | |||||
6.4e-05 1/K Show Supplier Material materials with Coefficient of thermal expansion of 6.4e-05 1/K | DIN EN ISO 11359-1/2 | at 200-250°C, Transverse | |||||
Heat deflection temperature | 221 °C Show Supplier Material materials with Heat deflection temperature of 221 °C | ISO-R 75 Method A | 1.8 MPa | ||||
Max service temperature | 200 °C Show Supplier Material materials with Max service temperature of 200 °C | Long | |||||
260 °C Show Supplier Material materials with Max service temperature of 260 °C | Short | ||||||
Melting point | 310 °C Show Supplier Material materials with Melting point of 310 °C | ||||||
Specific heat capacity | 1110 J/(kg·K) Show Supplier Material materials with Specific heat capacity of 1110 J/(kg·K) | DIN EN 821 | |||||
Thermal conductivity | 0.46 W/(m·K) Show Supplier Material materials with Thermal conductivity of 0.46 W/(m·K) | DIN EN 821 | through-plane | ||||
2.14 W/(m·K) Show Supplier Material materials with Thermal conductivity of 2.14 W/(m·K) | DIN EN 821 | in-plane | |||||
Thermal diffusivity | 0.24 mm²/s Show Supplier Material materials with Thermal diffusivity of 0.24 mm²/s | DIN EN 821 | in-plane | ||||
1.1 mm²/s Show Supplier Material materials with Thermal diffusivity of 1.1 mm²/s | DIN EN 821 | through-plane | |||||
Flammability | UL94 class V0, DIN IEC 60695-11-10 |
Electrical
Property | Value | Testing Standard |
---|---|---|
Comparative tracking index | 150 V Show Supplier Material materials with Comparative tracking index of 150 V | DIN EN 60112 |
Surface resistivity | 1.3e+15 Ω/sq Show Supplier Material materials with Surface resistivity of 1.3e+15 Ω/sq | DIN EN 61340-2-3 |
Volume resistivity | 2.8e+17 Ω·cm Show Supplier Material materials with Volume resistivity of 2.8e+17 Ω·cm | DIN EN 61340-2-3 |
Rheological Properties
Technological properties
Property | ||
---|---|---|
Application areas | Electrical engineering, LED lighting technology, Mechanical engineering, Automotive industry camera, moulded interconnect device (PCB, LDS), power distribution in electronics and radar | |
Color | Black | |
Processing methods | Permissible residual moisture content (%): 0.1, drying temperature (°C): 150, drying time (h): 44294, mould temperature (°C): 80-150, material temperature (°C): 320-350, cylinder/processing temperature (°C): 300-350, back pressure (bar): 300-900, injection rate: fast | |
Surface Finish | Laser Marking Parameter- Power: 2-5 W - Frequency: 100-200 kHz - Forw ard movement: 1.6-3.2 m/s |