TECACOMP LCP LDS black 1049426

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Description

LCP (Liquid crystal polymer) developed for the LPKF-LDS® process with low thermal expansion

Equivalent Materials

This material data has been provided by Ensinger GmbH.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyValueTesting StandardComment

Bulk density

0.97 g/cm³

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EN ISO 60

Density

1.74 g/cm³

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Water absorption

0.1 %

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DIN EN ISO 62

max. | 23°C | 50 % r.h. up to saturation

Mechanical

PropertyValueTesting Standard

Elastic modulus

9.7 GPa

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DIN EN ISO 527-1

Elongation

1.6 %

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DIN EN ISO 527-1

Impact strength, Charpy unnotched

15 kJ/m²

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DIN EN ISO 179-1eU

Tensile strength

85 MPa

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DIN EN ISO 527-1

Thermal

PropertyValueTesting StandardPressureComment

Coefficient of thermal expansion

8e-06 1/K

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DIN EN ISO 11359-1/2

at 50-100°C

1.1e-05 1/K

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DIN EN ISO 11359-1/2

at 100-150°C

1.3e-05 1/K

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DIN EN ISO 11359-1/2

at 200-250°C

1.4e-05 1/K

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DIN EN ISO 11359-1/2

at 150-200°C

3.4e-05 1/K

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DIN EN ISO 11359-1/2

at 50-100°C, Transverse

4.4e-05 1/K

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DIN EN ISO 11359-1/2

at 100-150°C, Transverse

5.3e-05 1/K

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DIN EN ISO 11359-1/2

at 150-200°C, Transverse

6.4e-05 1/K

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DIN EN ISO 11359-1/2

at 200-250°C, Transverse

Heat deflection temperature

221 °C

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ISO-R 75 Method A

1.8 MPa

Max service temperature

200 °C

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Long

260 °C

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Short

Melting point

310 °C

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Specific heat capacity

1110 J/(kg·K)

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DIN EN 821

Thermal conductivity

0.46 W/(m·K)

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DIN EN 821

through-plane

2.14 W/(m·K)

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DIN EN 821

in-plane

Thermal diffusivity

0.24 mm²/s

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DIN EN 821

in-plane

1.1 mm²/s

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DIN EN 821

through-plane

Flammability

UL94 class V0, DIN IEC 60695-11-10

Electrical

PropertyValueTesting Standard

Comparative tracking index

150 V

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DIN EN 60112

Surface resistivity

1.3e+15 Ω/sq

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DIN EN 61340-2-3

Volume resistivity

2.8e+17 Ω·cm

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DIN EN 61340-2-3

Rheological Properties

PropertyValueTesting StandardComment

Shrinkage

0.03 %

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DIN EN ISO 294-4

0.56 %

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DIN EN ISO 294-4

Transverse

Technological properties

Property
Application areas

Electrical engineering, LED lighting technology, Mechanical engineering, Automotive industry

camera, moulded interconnect device (PCB, LDS), power distribution in electronics and radar

Color

Black

Processing methods

Permissible residual moisture content (%): 0.1, drying temperature (°C): 150, drying time (h): 44294, mould temperature (°C): 80-150, material temperature (°C): 320-350, cylinder/processing temperature (°C): 300-350, back pressure (bar): 300-900, injection rate: fast

Surface Finish

Laser Marking Parameter- Power: 2-5 W - Frequency: 100-200 kHz - Forw ard movement: 1.6-3.2 m/s