Stabar K200 Polyetheretherketone Polymer Film (EK301075)

Alternative and trade names
Stabar K200 Polyetheretherketone Polymer Film (EK301075)


PEEK is an inherently crystalline polymer with a high crystalline melting point of 340 °C, but “Stabar” K200 film has been manufactured in such a way that full crystallinity has not been developed in the film. The result is that “Stabar” K200 is a highly transparent low haze film and has the ability to be thermoformed and embossed at temperature below 200 °C.

Heat treatment of “Stabar” K200 film between its melting point and the glass transition temperature of 143 °C will induce crystallisation as seen by the onset of opacity, higher rigidity at high temperatures, and improved solvent resistance.



Coefficient of hygroscopic expansion CHE

5E-6 % at 20 °C

Limiting oxygen index LOI

25 % at 20 °C


Permeability coefficient cperm

13 cm²/s at 20 °C


Shrinkage cshrink

0.5 % at 150 °C


Shrinkage, transverse cshrink, trans

0.5 % at 150 °C


Water absorption cwater

0.4 % at 20 °C



Elongation A

240 % at 23 °C


Elongation, transverse A

240 % at 23 °C


Tensile strength Rm

120 MPa at 23 °C


Tensile strength, transverse Rm,trans

120 MPa at 23 °C



Coefficient of thermal expansion α

4E-5 1/K at 110 °C


UL94 VTM -1 (100 micron)

Glass transition temperature Tg

143 °C

Max service temperature, long Tmaxlong

250 °C

Specific heat capacity cp

1450 J/(kg·K) at 20 °C


Dielectric constant εr

3.3 [-] at 25 °C

at 50Hz, D150

Dielectric strength EDS

128 kV/mm at 20 °C


Dissipation factor, 50Hz ε''50Hz

1.8E-3 [-] at 25 °C


Show chart

Electrical resistivity ρel

1.00E+15 Ω·m at 25 °C


Technological properties


“Stabar” K200 film offers an excellent combination of properties including: Intrinsic long term heat stability; Low flammability and extremely low smoke and toxic gas evolution on burning; Resistance to attack by a wide range of organic and inorganic chemicals and solvents; Low water absorption and good hydrolysis resistance at high temperatures and pressures; Resistance to radiation (X-rays, beta-rays and gamma rays) is amongst the best of thermoplastic materials; Good tear and fatigue resistance; Retention of good electrical properties over a wide temperature range.

Processing methods

“Stabar” K200 film can be adhesion-bonded either to itself or to other substrates, the bond strengths being dependent upon the type of adhesive and the surface preparation. “Stabar” K200 film may be fusion- bonded to itself, to reinforcements and to other substrates by application of heat and pressure. “Stabar” K200 film can be metallised by vacuum deposition and sputtering techniques, and is compatible with a range of inks and lacquers.

This material data has been provided by Goodfellow.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.