LEXAN™ Resin EX1332T

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LEXAN EX1332T polycarbonate resin is designed for use in multi-wall sheet or profile extrusion applications. It contains branched polycarbonate resin, release, and is UV stabilized. It is available in a limited number of colors.

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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23.0 °C

1.2 g/cm³

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ISO 1183

Water absorption

23.0 °C

0.15 %

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ISO 62 | 23°C, 50% RH



Elastic modulus

23.0 °C

2.35 GPa

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ISO 527 | 1 mm/min

Elongation at yield

23.0 °C

7 %

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ISO 527 | 50 mm/min

Flexural modulus

23.0 °C

2.3 GPa

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ISO 178 | 2 mm/min

Flexural yield strength

23.0 °C

95 MPa

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ISO 178 | 2 mm/min

Impact strength, Charpy notched

-30.0 °C

50 kJ/m²

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ISO 179/1eA

23.0 °C

70 kJ/m²

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ISO 179/1eA

Impact strength, Izod notched

-30.0 °C

55 kJ/m²

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ISO 180/1A

23.0 °C

75 kJ/m²

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ISO 180/1A

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Tensile strength

23.0 °C

70 MPa

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ISO 527 | 50 mm/min

Yield strength

23.0 °C

65 MPa

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ISO 527 | 50 mm/min

Impact strength, Charpy unnotched

No Break @ 23,-30°C | ISO 179/1eU

Impact strength, Izod unnotched

No Break @ 23,-30°C| ISO 180/1U



Coefficient of thermal expansion

23.0 °C

7E-5 1/K

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ISO 11359-2 | -23°C to 80°C

Heat deflection temperature, 1.80 MPa

130 °C

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ISO 75/Af | 1.8 MPa

Thermal conductivity

23.0 °C

0.2 W/(m·K)

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ISO 8302

Vicat softening temperature

150 °C

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ISO 306 | Rate B/120




88 - 90 %

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ASTM D 1003 | 2.54 mm

Rheological Properties


Melt volume-flow rate

5 cm³/10min

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ISO 1133 | 300°C/2.16 kg


23.0 °C

0.5 - 0.7 %

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SABIC method | 3.2 mm

Technological properties

Application areas

Additive Semiconductor Materials,Air Filtration,Body Protection,Building Element,Building/Construction Sheet,Cladding/Roof,Document Handling,Heavy Vehicles,LED Lighting,Non-LED Lighting,Traffic Management,Wiring Devices

Processing methods

Drying Temperature: 120°C, Drying Time: 2-4hrs, Barrel - Zone 1 Temperature: 260-300°C, Barrel - Zone 2 Temperature: 260-290°C, Barrel - Zone 3 Temperature: 260-290°C, Hopper Temperature: 100-120°C, Adapter Temperature: 240-280°C, Die Temperature: 240-300°C, Melt Temperature: 260-300°C