LEXAN™ Resin HF1840R

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Description

LEXAN HF1840R polycarbonate resin, MVR (300C/1.2kg) 36 cm3/10min, extreme low viscosity, injection molding, mold release, transparent. FDA foodcontact compliant in limited colors. FDA 21CFR177.1580, European food contacto regulation EC Directive 2002/72/EC.

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.2 g/cm³

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ISO 1183

Water absorption

23.0 °C

0.15 %

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ISO 62 | 23°C, 50% RH

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2.3 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

70 %

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ISO 527 | 50 mm/min

Elongation at yield

23.0 °C

6 %

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ISO 527 | 50 mm/min

Flexural modulus

23.0 °C

2.3 GPa

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ISO 178 | 2 mm/min

Flexural yield strength

23.0 °C

85 MPa

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ISO 178 | 2 mm/min

Hardness, Ball Indentation

23.0 °C

95 MPa

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ISO 2039-1

Impact strength, Charpy notched

-30.0 °C

11 kJ/m²

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ISO 179/1eA

23.0 °C

55 kJ/m²

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ISO 179/1eA

Impact strength, Izod notched

-30.0 °C

11 kJ/m²

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ISO 180/1A

23.0 °C

55 kJ/m²

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ISO 180/1A

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Tensile strength

23.0 °C

55 MPa

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ISO 527 | 50 mm/min

Yield strength

23.0 °C

60 MPa

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ISO 527 | 50 mm/min

Impact strength, Charpy unnotched

No Break @ 23,-30°C | ISO 179/1eU

Impact strength, Izod unnotched

No Break @ 23,-30°C| ISO 180/1U

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

7E-5 1/K

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ISO 11359-2 | -23°C to 80°C

Heat deflection temperature, 0.45 MPa

130 °C

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ISO 75/Bf | 0.45 MPa

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Thermal conductivity

23.0 °C

0.2 W/(m·K)

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ISO 8302

Vicat softening temperature

140 °C

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ISO 306 | Rate B/120

Electrical

PropertyTemperatureValueComment

Dielectric constant

23.0 °C

2.7 [-]

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IEC 60250 | at 50/60 Hz

Dielectric strength

23.0 °C

17 kV/mm

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IEC 60243-1 | in oil, 3.2 mm

Dissipation factor

23.0 °C

0.01 [-]

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IEC 60250 | at 1 MHz

Optical

PropertyValueComment

Refractive index

1.59 [-]

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ISO 489

Transmission

88 - 90 %

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ASTM D 1003 | 2.54 mm

Rheological Properties

PropertyTemperatureValueComment

Melt volume-flow rate

36 cm³/10min

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ISO 1133 | 300°C/1.2 kg

Shrinkage

23.0 °C

0.5 - 0.7 %

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SABIC method

Technological properties

Property
Application areas

Additive Semiconductor Materials,Exterior Rail Components,Food Processor

Processing methods

Drying Temperature: 120°C, Drying Time: 2-4hrs, Maximum Moisture Content: 0.02%, Melt Temperature: 280-300°C, Nozzle Temperature: 270-290°C, Front - Zone 3 Temperature: 280-300°C, Middle - Zone 2 Temperature: 270-290°C, Rear - Zone 1 Temperature: 260-280°C, Hopper Temperature: 60-80°C, Mold Temperature: 80-100°C