LEXAN™ FR Resins ML1655R

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Description

For existing applications only.

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.21 g/cm³

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ASTM D 792

Water absorption

23.0 °C

0.15 %

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ASTM D 570 | 24 Hours

Water absorption, equilibrium

23.0 °C

0.35 %

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ASTM D 570

Mechanical

PropertyTemperatureValueComment

Elongation

23.0 °C

90 %

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ASTM D 638 | Type I, 50 mm/min

Elongation at yield

23.0 °C

7 %

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ASTM D 638 | Type I, 50 mm/min

Flexural modulus

23.0 °C

2.24 GPa

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ASTM D 790 | 1.3 mm/min, 50 mm span

Flexural yield strength

23.0 °C

91 MPa

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ASTM D 790 | 1.3 mm/min, 50 mm span

Hardness, Rockwell R

23.0 °C

118 [-]

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ASTM D 785

Impact strength, Izod notched, ASTM

23.0 °C

640 J/m

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ASTM D 256

Tensile strength

23.0 °C

55 MPa

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ASTM D 638 | Type I, 50 mm/min

Yield strength

23.0 °C

62 MPa

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ASTM D 638 | Type I, 50 mm/min

Thermal

PropertyTemperatureValueComment

Heat deflection temperature, 1.80 MPa

132 °C

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ASTM D 648 | 1.82 MPa, 6.4 mm, unannealed

Relative temperature index, electrical

130 °C

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UL 746B

Relative temperature index, mechanical impact

120 °C

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UL 746B

Relative temperature index, mechanical strength

130 °C

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UL 746B

Thermal conductivity

23.0 °C

0.19 W/(m·K)

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ASTM C177

Vicat softening temperature

151 °C

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ASTM D 1525 | Rate B/50

Flammability

UL Recognized, 94V-0 Flame Class Rating | 1.11mm | UL 94

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

2 V

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UL 746A

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

10 g/10min

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ASTM D 1238 | 300°C/1.2 kg

Shrinkage

23.0 °C

0.5 - 0.7 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Data Transfer,Electronic Components,Enclosure/Housing/Cover,Enclosures,Individual Equiptment,Security/Detection,Wireless Communications

Processing methods

Drying Temperature: 120°C, Drying Time: 3-4hrs, Drying Time (Cumulative): 48hrs, Maximum Moisture Content: 0.02%, Melt Temperature: 295-315°C, Nozzle Temperature: 290-310°C, Front - Zone 3 Temperature: 295-315°C, Middle - Zone 2 Temperature: 280-305°C, Rear - Zone 1 Temperature: 270-295°C, Mold Temperature: 70-95°C, Back Pressure: 0.3-0.7MPa, Screw Speed: 40-70rpm, Shot to Cylinder Size: 40-60%, Vent Depth: 0.025-0.076mm