VALOX™ FR Resins V3504

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Description

VALOX V3504 is an unreinforced, flame retardant Polybutylene Terephthalate (PBT) injection moldable grade with excellent chemical resistance. It has a UL94V0@0.38mm and 5VA@3.0mm flame rating. This is a good candidate for thin wall applications in the electrical industry including bobbins, keyboards, switches and appliance housings.

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.4 g/cm³

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Elongation

23.0 °C

9 %

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ASTM D 638 | Type I, 50 mm/min

Elongation at yield

23.0 °C

7 %

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ASTM D 638 | Type I, 50 mm/min

Flexural modulus

23.0 °C

2.6 GPa

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ISO 178 | 2 mm/min

Flexural yield strength

23.0 °C

88 MPa

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ISO 178 | 2 mm/min

Impact strength, Charpy notched

23.0 °C

4 kJ/m²

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ISO 179/1eA

Impact strength, Izod notched, ASTM

23.0 °C

52 J/m

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ASTM D 256

Yield strength

23.0 °C

58 MPa

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ASTM D 638 | Type I, 50 mm/min

Thermal

PropertyValueComment

Heat deflection temperature, 1.80 MPa

106 °C

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ASTM D 648 | 1.82 MPa, 6.4 mm, unannealed

Relative temperature index, electrical

120 °C

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UL 746B

Relative temperature index, mechanical impact

120 °C

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UL 746B

Relative temperature index, mechanical strength

140 °C

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UL 746B

Flammability

UL Recognized, 94-5VA Flame Class Rating | 3mm | UL 94

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

3 V

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UL 746A

Electrical resistivity

23.0 °C

1.00E+13 Ω·m

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IEC 60093

Rheological Properties

PropertyValueComment

Melt mass-flow rate

11 g/10min

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ASTM D 1238 | 250°C/2.16 kg

Melt volume-flow rate

8 cm³/10min

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ISO 1133 | 250°C/2.16 kg

Technological properties

Property
Application areas

Circuit Protection,Enclosures,Photovoltaic Components

Processing methods

Drying Temperature: 120°C, Drying Time: 3-4hrs, Drying Time (Cumulative): 12hrs, Maximum Moisture Content: 0.02%, Melt Temperature: 245-260°C, Nozzle Temperature: 240-255°C, Front - Zone 3 Temperature: 245-260°C, Middle - Zone 2 Temperature: 240-255°C, Rear - Zone 1 Temperature: 230-250°C, Mold Temperature: 50-75°C, Back Pressure: 0.3-0.7MPa, Screw Speed: 50-100rpm, Shot to Cylinder Size: 40-80%, Vent Depth: 0.013-0.025mm