Crastin® PC164 NC010

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Description

Crastin® PC164 NC010 (Complete Data) is an Unreinforced Low Viscosity Polybutylene Terephthalate

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.31 g/cm³

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ISO 1183

Water absorption

23.0 °C

0.4 %

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Sim. to ISO 62 | 80mil

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2.4 GPa

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ISO 527-1/-2

Elongation

23.0 °C

30 %

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ISO 527-1/-2

Elongation at yield

23.0 °C

4 %

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ISO 527-1/-2

Impact strength, Charpy notched

-6.0 °C

4 kJ/m²

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ISO 179/1eA

23.0 °C

4 kJ/m²

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ISO 179/1eA

Poisson's ratio

23.0 °C

0.38 [-]

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Yield strength

23.0 °C

55 MPa

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ISO 527-1/-2

Impact strength, Charpy unnotched

No Break @ 23°C, ISO 179/1eU

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.1E-4 1/K

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ISO 11359-1/-2

Coefficient of thermal expansion, transverse

23.0 °C

1.2E-4 1/K

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ISO 11359-1/-2

Glass transition temperature

55 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 0.45 MPa

180 °C

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ISO 75-1/-2 | annealed

Heat deflection temperature, 1.80 MPa

60 °C

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ISO 75-1/-2 | annealed

Melting point

225 °C

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ISO 11357-1/-3 | 18°F/min

Specific heat capacity

23.0 °C

2110 J/(kg·K)

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of melt

Vicat softening temperature

175 °C

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ISO 306 | 90°F, 2 lbf

Flammability

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, Oxygen index: 22 %

Electrical

PropertyTemperatureValueComment

Dielectric constant, 1MHz

23.0 °C

3.2 [-]

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IEC 62631-2-1

Dielectric strength

23.0 °C

26 kV/mm

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IEC 60243-1

Dissipation factor, 100Hz

23.0 °C

2E-3 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.02 [-]

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IEC 62631-2-1

Surface resistivity

23.0 °C

1.00E+12 Ω/sq

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IEC 62631-3-2

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

33 g/10min

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ISO 1133 | 250°C/2.16kg

Shrinkage

23.0 °C

1.6 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

1.6 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 120°C, Drying Time, Dehumidified Dryer: 2-4h, Processing Moisture Content: ≤0.04%, Melt Temperature Optimum: 250°C, Min. melt temperature: 240°C, Max. melt temperature: 260°C, Mold Temperature Optimum: 80°C, Min. mold temperature: 30°C, Max. mold temperature: 130°C, Hold pressure range: ≥60MPa, Hold pressure time: 4s/mm, Back pressure: As low as possible, Ejection temperature: 170°C