Zytel® HTN55G55TLW BK117

Alternative and trade names
PA-I-GF55

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTN55G55TLW BK117 is a 55% glass reinforced high performance polyamide resinwith improved toughness and low warpage, developed for structural applications where good flow is needed in thin sections. It is also a PPA resin.

This material data has been provided by Matmatch.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.66 g/cm³ Show Material materials with Density of 1.66 g/cm³	ISO 1183

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	18.7 GPa Show Material materials with Elastic modulus of 18.7 GPa	ISO 527-1/-2
Elongation	23.0 °C	1.8 % Show Material materials with Elongation of 1.8 %	ISO 527-1/-2
Flexural modulus	23.0 °C	17 GPa Show Material materials with Flexural modulus of 17 GPa	ISO 178
Flexural strength	23.0 °C	360 MPa Show Material materials with Flexural strength of 360 MPa	ISO 178
Impact strength, Charpy notched	-40.0 °C	20 kJ/m² Show Material materials with Impact strength, Charpy notched of 20 kJ/m²	ISO 179/1eA
	23.0 °C	18 kJ/m² Show Material materials with Impact strength, Charpy notched of 18 kJ/m²	ISO 179/1eA

Impact strength, Charpy unnotched	23.0 °C	75 kJ/m² Show Material materials with Impact strength, Charpy unnotched of 75 kJ/m²	ISO 179/1eU
Poisson's ratio	23.0 °C	0.33 [-] Show Material materials with Poisson's ratio of 0.33 [-]
Tensile strength	23.0 °C	243 MPa Show Material materials with Tensile strength of 243 MPa	ISO 527-1/-2

Thermal

Property	Value	Comment
Heat deflection temperature, 1.80 MPa	236 °C Show Material materials with Heat deflection temperature, 1.80 MPa of 236 °C	ISO 75-1/-2
Melting point	296 °C Show Material materials with Melting point of 296 °C	ISO 11357-1/-3 \| first heat
Flammability	Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Glow Wire Flammability Index, 30mil: 725 °C, Glow Wire Flammability Index, 60mil: 725 °C, Glow Wire Flammability Index, 120mil: 960 °C, Glow Wire Ignition Temperature, 30mil: 750 °C, Glow Wire Ignition Temperature, 60mil: 750 °C, Glow Wire Ignition Temperature, 120mil: 850 °C

Electrical

Property	Temperature	Value	Comment
Comparative tracking index	23.0 °C	600 V Show Material materials with Comparative tracking index of 600 V	IEC 60112

Technological properties

Property
Fillers	55% Glass Fiber
Processing methods	Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Min. melt temperature: 300°C, Max. melt temperature: 315°C, Min. mold temperature: 70°C, Max. mold temperature: 130°C

Zytel® HTN55G55TLW BK117

Description

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Properties