Zytel® HTN51G35EF BK083

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Description

Zytel® HTN51G35EF BK083 is a 35% glass reinforced, heat stabilized, lubricated, hydrolysis resistanthigh performance polyamide resin developed for electrical and electronics applications. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.47 g/cm³

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ISO 1183

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

12.1 GPa

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ISO 527-1/-2

Elongation

23.0 °C

2.4 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

11 GPa

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ISO 178

Flexural strength

23.0 °C

300 MPa

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ISO 178

Impact strength, Charpy notched

23.0 °C

10 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

23.0 °C

57 kJ/m²

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ISO 179/1eU

Poisson's ratio

23.0 °C

0.33 [-]

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Tensile strength

23.0 °C

220 MPa

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ISO 527-1/-2

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.8E-5 1/K

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ISO 11359-1/-2

Coefficient of thermal expansion, transverse

23.0 °C

5.7E-5 1/K

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ISO 11359-1/-2

Glass transition temperature

135 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 1.80 MPa

264 °C

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ISO 75-1/-2

Melting point

300 °C

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ISO 11357-1/-3 | first heat

Flammability

Oxygen index: 23 %, Glow Wire Flammability Index, 40mil: 750 °C, Glow Wire Ignition Temperature, 40mil: 750 °C, Glow Wire Ignition Temperature, 120mil: 800 °C, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

525 V

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IEC 60112

Dielectric constant, 100Hz

23.0 °C

4.4 [-]

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IEC 62631-2-1

Dielectric constant, 1MHz

23.0 °C

4.3 [-]

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IEC 62631-2-1

Dielectric strength

23.0 °C

32 kV/mm

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IEC 60243-1

Dissipation factor, 100Hz

23.0 °C

0.02 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.02 [-]

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IEC 62631-2-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.2 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

0.6 %

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ISO 294-4, 2577

Technological properties

Property
Fillers

35% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Mold Temperature Optimum: 150°C, Min. mold temperature: 140°C, Max. mold temperature: 180°C