Zytel® HTNFG52G35HSL BK011

Want to keep this datasheet? Save it now in your required format

Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTNFG52G35HSL BK011 is a 35% glass reinforced, lubricated, heat stabilized high performance polyamide resin, developed for consideration into applications for the food industry. It is also a PPA resin.FOOD CONTACTThis product is manufactured according to Good Manufacturing Practice (GMP) principles and generally accepted in food contact applications in Europe and the USA when meeting applicable use conditions. For details, individual compliance statements are available from your DuPont representative.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.45 g/cm³

Show Material materials with Density of 1.45 g/cm³

ISO 1183

Water absorption

23.0 °C

0.4 %

Show Material materials with Water absorption of 0.4 %

Sim. to ISO 62 | Immersion 24h

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

12 GPa

Show Material materials with Elastic modulus of 12 GPa

ISO 527-1/-2

Elongation

23.0 °C

1.8 %

Show Material materials with Elongation of 1.8 %

ISO 527-1/-2

Impact strength, Charpy notched

23.0 °C

8 kJ/m²

Show Material materials with Impact strength, Charpy notched of 8 kJ/m²

ISO 179/1eA

Impact strength, Charpy unnotched

23.0 °C

38 kJ/m²

Show Material materials with Impact strength, Charpy unnotched of 38 kJ/m²

ISO 179/1eU

Poisson's ratio

23.0 °C

0.33 [-]

Show Material materials with Poisson's ratio of 0.33 [-]

Tensile strength

23.0 °C

200 MPa

Show Material materials with Tensile strength of 200 MPa

ISO 527-1/-2

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

2E-5 1/K

Show Material materials with Coefficient of thermal expansion of 2E-5 1/K

ISO 11359-1/-2

Coefficient of thermal expansion, transverse

23.0 °C

6E-5 1/K

Show Material materials with Coefficient of thermal expansion, transverse of 6E-5 1/K

ISO 11359-1/-2

Heat deflection temperature, 1.80 MPa

285 °C

Show Material materials with Heat deflection temperature, 1.80 MPa of 285 °C

ISO 75-1/-2

Melting point

310 °C

Show Material materials with Melting point of 310 °C

ISO 11357-1/-3 | first heat

Relative temperature index, electrical

150 °C

Show Material materials with Relative temperature index, electrical of 150 °C

UL 746B | 120mil

Relative temperature index, mechanical impact

125 °C

Show Material materials with Relative temperature index, mechanical impact of 125 °C

UL 746B | 120mil

Relative temperature index, mechanical strength

150 °C

Show Material materials with Relative temperature index, mechanical strength of 150 °C

UL 746B | 120mil

Flammability

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Oxygen index: 25 %, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Electrical

PropertyTemperatureValueComment

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

Show Material materials with Volume resistivity of 1.00E+15 Ω·cm

IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.2 %

Show Material materials with Shrinkage of 0.2 %

ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

0.8 %

Show Material materials with Shrinkage, transverse of 0.8 %

ISO 294-4, 2577

Technological properties

Property
Fillers

35% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 90°C, Max. mold temperature: 110°C