Zytel® HTNFR52G45BL BK337

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTNFR52G45BL BK337 is a 45% glass reinforced, flame retardant, lubricated high performance polyamide resin that has been developed for connector applications.

Equivalent Materials

This material data has been provided by Matmatch.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.76 g/cm³

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ISO 1183

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

17 GPa

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ISO 527-1/-2

Elongation

23.0 °C

1.3 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

15.2 GPa

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ISO 178

Flexural strength

23.0 °C

290 MPa

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ISO 178

Impact strength, Charpy notched

-40.0 °C

13 kJ/m²

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ISO 179/1eA

23.0 °C

13 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

-6.0 °C

40 kJ/m²

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ISO 179/1eU

23.0 °C

42 kJ/m²

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ISO 179/1eU

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Impact strength, Izod unnotched

23.0 °C

12 kJ/m²

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ISO 180/1A

Poisson's ratio

23.0 °C

0.33 [-]

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Tensile strength

23.0 °C

175 MPa

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ISO 527-1/-2

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

8E-6 1/K

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ISO 11359-1/-2 | 23 - 55°C

Coefficient of thermal expansion, transverse

23.0 °C

7.5E-5 1/K

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ISO 11359-1/-2 | 55 - 160°C

Heat deflection temperature, 0.45 MPa

300 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

284 °C

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ISO 75-1/-2

Melting point

310 °C

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ISO 11357-1/-3 | first heat

Relative temperature index, electrical

140 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

120 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

130 °C

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UL 746B | 120mil

Flammability

Burning Behav. at 60mil nom. thickn.: V-0 class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: V-0 class, Thickness tested: 0.75 mm, UL recognition: yes -, Oxygen index: 49 %, Glow Wire Flammability Index, 40mil: 960 °C, Glow Wire Ignition Temperature, 40mil: 900 °C, Glow Wire Temperature, No Flame, 40mil: 875 °C, Glow Wire Temperature, No Flame, 60mil: 875 °C, Glow Wire Temperature, No Flame, 80mil: 875 °C, Glow Wire Temperature, No Flame, 120mil: 875 °C, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

500 V

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IEC 60112

Dielectric constant, 100Hz

23.0 °C

3.9 [-]

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IEC 62631-2-1

Dielectric constant, 1MHz

23.0 °C

3.6 [-]

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IEC 62631-2-1

Dielectric strength

23.0 °C

31 kV/mm

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IEC 60243-1

Dissipation factor, 100Hz

23.0 °C

4.5E-3 [-]

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IEC 62631-2-1

Dissipation factor, 1GHz

23.0 °C

0.01 [-]

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ASTM D 2520 B

Dissipation factor, 1MHz

23.0 °C

0.01 [-]

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IEC 62631-2-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.2 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

0.6 %

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ISO 294-4, 2577

Technological properties

Property
Fillers

45% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 90°C, Max. mold temperature: 110°C