Zytel® HTNFE8200 BK431

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Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTNFE8200 BK431 is an unreinforced, toughened, heat stabilized high performance polyamide resin for injection molding. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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23.0 °C

1.13 g/cm³

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ISO 1183



Elastic modulus

23.0 °C

2.2 GPa

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ISO 527-1/-2


23.0 °C

14 %

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ISO 527-1/-2

Elongation at yield

23.0 °C

5.5 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

2.1 GPa

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ISO 178

Impact strength, Charpy notched

23.0 °C

80 kJ/m²

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ISO 179/1eA

Poisson's ratio

23.0 °C

0.39 [-]

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Yield strength

23.0 °C

69 MPa

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ISO 527-1/-2

Impact strength, Charpy unnotched

No Break @ 23,-6°C, ISO 179/1eA



Heat deflection temperature, 0.45 MPa

138 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

125 °C

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ISO 75-1/-2

Melting point

300 °C

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ISO 11357-1/-3 | first heat


FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min



Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties



23.0 °C

1 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

1 %

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ISO 294-4, 2577

Technological properties

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 80°C, Max. mold temperature: 120°C