Zytel® ST801 NC010A

Alternative and trade names
PA66-HI
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Description

Common features of Zytel® nylon resin include mechanical and physical properties such as high mechanical strength, excellent balance of stiffness and toughness, good high temperature performance, good electrical and flammability properties, good abrasion and chemical resistance. In addition, Zytel® nylon resins are available in different modified and reinforced grades to create a wide range of products with tailored properties for specific processes and end-uses. Zytel® nylon resin, including most flame retardant grades, offer the ability to be coloured. The good melt stability of Zytel® nylon resin normally enables the recycling of properly handled production waste. If recycling is not possible, DuPont recommends, as the preferred option, incineration with energy recovery (-31kJ/g of base polymer) in appropriately equipped installations. For disposal, local regulations have to be observed.Zytel® nylon resin typically is used in demanding applications in the automotive, furniture, domestic appliances, sporting goods and construction industry.Zytel® ST801 NC010A is an unreinforced, super tough polyamide 66 for injection molding and extrusion. It offers outstanding impact resistance over a wide temperature and humidity range and high productivity.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.08 g/cm³

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ISO 1183

Water absorption

23.0 °C

6.5 %

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Sim. to ISO 62 | 80mil

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2 GPa

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ISO 527-1/-2

Elongation

23.0 °C

32 %

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ISO 527-1/-2

Elongation at yield

23.0 °C

5.7 %

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ISO 527-1/-2

Hardness, Ball Indentation

23.0 °C

104 MPa

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ISO 2039-1

Impact strength, Charpy notched

-6.0 °C

18 kJ/m²

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ISO 179/1eA

23.0 °C

80 kJ/m²

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ISO 179/1eA

Impact strength, Izod unnotched

-40.0 °C

14 kJ/m²

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ISO 180/1A

-30.0 °C

19 kJ/m²

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ISO 180/1A

23.0 °C

80 kJ/m²

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ISO 180/1A

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Poisson's ratio

23.0 °C

0.4 [-]

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Yield strength

23.0 °C

50 MPa

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ISO 527-1/-2

Impact strength, Charpy unnotched

No Break @ 23,-6°C, ISO 179/1eA

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.2E-4 1/K

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ISO 11359-1/-2

Coefficient of thermal expansion, transverse

23.0 °C

9E-5 1/K

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ISO 11359-1/-2

Glass transition temperature

75 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 0.45 MPa

132 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

64 °C

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ISO 75-1/-2

Melting point

263 °C

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ISO 11357-1/-3 | 18°F/min

Relative temperature index, electrical

125 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

75 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

85 °C

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UL 746B | 120mil

Flammability

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.81 mm, UL recognition: yes -, Oxygen index: 20 %, Glow Wire Flammability Index, 30mil: 725 °C, Glow Wire Flammability Index, 60mil: 675 °C, Glow Wire Flammability Index, 120mil: 650 °C, Glow Wire Ignition Temperature, 30mil: 675 °C, Glow Wire Ignition Temperature, 60mil: 675 °C, Glow Wire Ignition Temperature, 120mil: 675 °C, Glow Wire Temperature, No Flame, 30mil: 700 °C, Glow Wire Temperature, No Flame, 40mil: 700 °C, Glow Wire Temperature, No Flame, 60mil: 700 °C, Glow Wire Temperature, No Flame, 80mil: 700 °C, Glow Wire Temperature, No Flame, 120mil: 700 °C, FMVSS Class: B -, Burning rate, Thickness 1 mm: 26 mm/min

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

600 V

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IEC 60112

Dielectric constant, 100Hz

23.0 °C

3.2 [-]

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IEC 62631-2-1

Dielectric constant, 1MHz

23.0 °C

2.9 [-]

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IEC 62631-2-1

Dielectric strength

23.0 °C

31 kV/mm

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IEC 60243-1

Dissipation factor, 100Hz

23.0 °C

8E-3 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.01 [-]

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IEC 62631-2-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

1.8 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

1.4 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 80°C, Drying Time, Dehumidified Dryer: 2-4h, Processing Moisture Content: ≤0.2%, Melt Temperature Optimum: 290°C, Min. melt temperature: 280°C, Max. melt temperature: 300°C, Max. screw tangential speed: 0.3m/s, Mold Temperature Optimum: 80°C, Min. mold temperature: 50°C, Max. mold temperature: 100°C, Hold pressure range: 50-100MPa, Hold pressure time: 4s/mm, Ejection temperature: 190°C