Zytel® HTN51G45HSL BK083

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Description

Zytel® HTN51G45HSL BK083 is a 45% glass reinforced, heat stabilized, lubricated, hydrolysis resistanthigh performance polyamide resin. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.57 g/cm³

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ISO 1183

Water absorption

23.0 °C

3.6 %

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Sim. to ISO 62 | 80mil

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

15 GPa

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ISO 527-1/-2

Elongation

23.0 °C

2.3 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

13.2 GPa

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ISO 178

Impact strength, Charpy notched

-6.0 °C

12 kJ/m²

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ISO 179/1eA

23.0 °C

12 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

-6.0 °C

80 kJ/m²

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ISO 179/1eU

23.0 °C

85 kJ/m²

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ISO 179/1eU

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Impact strength, Izod unnotched

-40.0 °C

13 kJ/m²

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ISO 180/1A

23.0 °C

12 kJ/m²

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ISO 180/1A

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Poisson's ratio

23.0 °C

0.33 [-]

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Tensile strength

23.0 °C

240 MPa

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ISO 527-1/-2

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.3E-5 1/K

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ISO 11359-1/-2 | 23 - 55°C

Coefficient of thermal expansion, transverse

23.0 °C

6.5E-5 1/K

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ISO 11359-1/-2 | 55 - 160°C

Glass transition temperature

135 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 0.45 MPa

285 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

265 °C

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ISO 75-1/-2

Melting point

300 °C

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ISO 11357-1/-3 | first heat

Relative temperature index, electrical

150 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

150 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

150 °C

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UL 746B | 120mil

Flammability

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.85 mm, UL recognition: yes -, FMVSS Class: B -, Burning rate, Thickness 1 mm: 29 mm/min

Electrical

PropertyTemperatureValueComment

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.2 %

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ISO 294-4 | Annealed

Shrinkage, transverse

23.0 °C

0.7 %

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ISO 294-4 | Annealed

Technological properties

Property
Fillers

45% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Mold Temperature Optimum: 150°C, Min. mold temperature: 140°C, Max. mold temperature: 180°C