Zytel® HTN92G35DH2 BK083

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTN92G35DH2 BK083 is a 35% glass reinforced high performance polyamide resin using DuPont SHIELD Technology, with high flow and excellent retention of properties after aging at elevated temperatures in air. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.44 g/cm³

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ISO 1183

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

12 GPa

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ISO 527-1/-2

Elongation

23.0 °C

2.4 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

10 GPa

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ISO 178

Flexural strength

23.0 °C

270 MPa

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ISO 178

Impact strength, Charpy notched

-40.0 °C

10 kJ/m²

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ISO 179/1eA

23.0 °C

10 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

-6.0 °C

50 kJ/m²

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ISO 179/1eU

23.0 °C

55 kJ/m²

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ISO 179/1eU

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Poisson's ratio

23.0 °C

0.33 [-]

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Tensile strength

23.0 °C

200 MPa

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ISO 527-1/-2

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.9E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Coefficient of thermal expansion, transverse

23.0 °C

6.3E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Heat deflection temperature, 1.80 MPa

283 °C

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ISO 75-1/-2

Melting point

310 °C

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ISO 11357-1/-3 | first heat

Flammability

FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

600 V

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IEC 60112

Dielectric strength

23.0 °C

32 kV/mm

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IEC 60243-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Melt volume-flow rate

60 cm³/10min

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ISO 1133

Shrinkage

23.0 °C

0.2 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

0.9 %

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ISO 294-4, 2577

Technological properties

Property
Fillers

35% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 90°C, Max. mold temperature: 110°C