Zytel® HTN51G15HSL BK083

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Description

Zytel® HTN51G15HSL BK083 is a 15% glass reinforced, heat stabilized, lubricated, hydrolysis resistant high performance polyamide resin. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.3 g/cm³

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ISO 1183

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

6.5 GPa

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ISO 527-1/-2

Elongation

23.0 °C

2 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

5.8 GPa

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ISO 178

Impact strength, Charpy notched

-40.0 °C

5 kJ/m²

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ISO 179/1eA

23.0 °C

5 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

23.0 °C

23 kJ/m²

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ISO 179/1eU

Impact strength, Izod unnotched

-40.0 °C

5 kJ/m²

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ISO 180/1A

23.0 °C

5 kJ/m²

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ISO 180/1A

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Poisson's ratio

23.0 °C

0.35 [-]

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Tensile strength

23.0 °C

110 MPa

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ISO 527-1/-2

Thermal

PropertyValueComment

Glass transition temperature

135 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 0.45 MPa

276 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

250 °C

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ISO 75-1/-2

Melting point

300 °C

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ISO 11357-1/-3 | first heat

Relative temperature index, electrical

150 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

130 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

150 °C

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UL 746B | 120mil

Flammability

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Oxygen index: 23 %, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

575 V

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IEC 60112

Dielectric constant, 1MHz

23.0 °C

3.7 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.02 [-]

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IEC 62631-2-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.3 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

0.6 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Mold Temperature Optimum: 150°C, Min. mold temperature: 140°C, Max. mold temperature: 180°C