Zytel® HTN51G35HSL NC010

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries.Zytel® HTN51G35HSL NC010is a 35% glass reinforced, heat stabilized, lubricated, hydrolysis resistanthigh performance polyamide resin. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.47 g/cm³

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ISO 1183

Water absorption

23.0 °C

4.5 %

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Sim. to ISO 62 | 80mil

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

12 GPa

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ISO 527-1/-2

Elongation

23.0 °C

2.4 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

10.3 GPa

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ISO 178

Flexural strength

23.0 °C

300 MPa

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ISO 178

Hardness, Rockwell M

23.0 °C

108 [-]

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ISO 2039-2

Hardness, Rockwell R

23.0 °C

124 [-]

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ISO 2039-2

Impact strength, Charpy notched

-40.0 °C

11 kJ/m²

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ISO 179/1eA

-6.0 °C

10 kJ/m²

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ISO 179/1eA

23.0 °C

11 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

-6.0 °C

60 kJ/m²

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ISO 179/1eU

23.0 °C

70 kJ/m²

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ISO 179/1eU

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Impact strength, Izod notched

-30.0 °C

50 kJ/m²

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ISO 180/1U

Impact strength, Izod unnotched

-30.0 °C

10 kJ/m²

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ISO 180/1A

23.0 °C

11 kJ/m²

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ISO 180/1A

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Poisson's ratio

23.0 °C

0.33 [-]

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Tensile strength

23.0 °C

210 MPa

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ISO 527-1/-2

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.8E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Coefficient of thermal expansion, transverse

23.0 °C

5.5E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Glass transition temperature

135 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 0.45 MPa

284 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

264 °C

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ISO 75-1/-2

Melting point

300 °C

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ISO 11357-1/-3 | first heat

Relative temperature index, electrical

150 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

130 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

150 °C

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UL 746B | 120mil

Specific heat capacity

23.0 °C

1860 J/(kg·K)

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of melt

Vicat softening temperature

290 °C

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ISO 306 | 90°F/h, 11 lbf

Flammability

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.85 mm, UL recognition: yes -, Oxygen index: 24 %, Glow Wire Flammability Index, 30mil: 750 °C, Glow Wire Flammability Index, 60mil: 750 °C, Glow Wire Flammability Index, 120mil: 960 °C, Glow Wire Ignition Temperature, 60mil: 775 °C, Glow Wire Ignition Temperature, 120mil: 800 °C, FMVSS Class: B -, Burning rate, Thickness 1 mm: 23 mm/min

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

600 V

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IEC 60112

Dielectric constant, 100Hz

23.0 °C

4 [-]

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IEC 62631-2-1

Dielectric constant, 1MHz

23.0 °C

4 [-]

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IEC 62631-2-1

Dielectric strength

23.0 °C

36 kV/mm

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IEC 60243-1

Dissipation factor, 1MHz

23.0 °C

0.01 [-]

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IEC 62631-2-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.2 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

0.6 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Mold Temperature Optimum: 150°C, Min. mold temperature: 140°C, Max. mold temperature: 180°C