Zytel® HTNFE8200 NC010

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries.Zytel® HTNFE8200 NC010 is an unreinforced, toughened, heat stabilized high performance polyamide resin for injection molding. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.13 g/cm³

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ISO 1183

Water absorption

23.0 °C

6.3 %

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Sim. to ISO 62 | 80mil

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2.2 GPa

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ISO 527-1/-2

Elongation

23.0 °C

14 %

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ISO 527-1/-2

Elongation at yield

23.0 °C

5.5 %

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ISO 527-1/-2

Flexural modulus

23.0 °C

2.1 GPa

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ISO 178

Impact strength, Charpy notched

23.0 °C

75 kJ/m²

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ISO 179/1eA

Impact strength, Izod unnotched

-40.0 °C

18 kJ/m²

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ISO 180/1A

23.0 °C

75 kJ/m²

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ISO 180/1A

Poisson's ratio

23.0 °C

0.39 [-]

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Yield strength

23.0 °C

68 MPa

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ISO 527-1/-2

Impact strength, Charpy unnotched

No Break @ 23,-6°C, ISO 179/1eA

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

9E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Coefficient of thermal expansion, transverse

23.0 °C

9E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Heat deflection temperature, 0.45 MPa

138 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

126 °C

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ISO 75-1/-2

Melting point

300 °C

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ISO 11357-1/-3 | first heat

Relative temperature index, electrical

65 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

65 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

65 °C

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UL 746B | 120mil

Specific heat capacity

23.0 °C

2220 J/(kg·K)

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of melt

Flammability

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

600 V

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IEC 60112

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.8 %

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ISO 294-4, 2577

Shrinkage, transverse

23.0 °C

0.9 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 80°C, Max. mold temperature: 120°C, Ejection temperature: 225°C