Zytel® HTN52G45HSL BK083

Alternative and trade names
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Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries.Zytel® HTN52G45HSL BK083 is a 45% glass reinforced, heat stabilized, lubricated high performance polyamide resin that can be molded in water heated molds. It is also a PPA resin.

Equivalent Materials

This material data has been provided by Matmatch.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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23.0 °C

1.56 g/cm³

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ISO 1183



Elastic modulus

23.0 °C

15.5 GPa

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ISO 527-1/-2


23.0 °C

2 %

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ISO 527-1/-2

Impact strength, Charpy notched

23.0 °C

12 kJ/m²

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ISO 179/1eA

Impact strength, Charpy unnotched

23.0 °C

65 kJ/m²

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ISO 179/1eU

Poisson's ratio

23.0 °C

0.33 [-]

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Tensile strength

23.0 °C

235 MPa

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ISO 527-1/-2



Glass transition temperature

90 °C

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ISO 11357-1/-2 | 18°F/min

Specific heat capacity

23.0 °C

2050 J/(kg·K)

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of melt


FMVSS Class: B -, Burning rate, Thickness 1 mm: 17 mm/min

Technological properties


45% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Mold Temperature Optimum: 100°C, Min. mold temperature: 90°C, Max. mold temperature: 110°C, Ejection temperature: 240°C