Reinforced Polyamidimide Reinforced with 30% Glass Fibre (PAI+GF30)

Alternative and trade names


It is a 30% glass fiber reinforced polyamide-imide (PAI, engineering plastic). It has high strength, elastic modulus and creep resistance. It has thermal expansion behaviour similar to aluminum and therefore excellent dimensional stability. It has the highest strength among other thermoplastics up to 275°C. It has outstanding wear, creep and chemical resistance. The machanical properties makes it a candidate for metal replacement in high temperatures and high stress applications. It has perfect electrical properties which makes it suitable for high preformance parts such as connectors and relays.



Density ρ

1.59 - 1.61 g/cm³ at 20 °C


Elastic modulus E

12 - 14.5 GPa at 20 °C

Elongation A

2 - 3 % at 20 °C

Impact strength, Charpy notched Ivnot

5 kJ/m² at 20 °C

Impact strength, Charpy unnotched Iunnot

27 kJ/m² at 20 °C

Max allowed stress σmax

205 - 220 MPa at 20 °C

at 2-3% strain


Coefficient of thermal expansion α

1.6E-5 1/K at 20 °C


UL 94 V0

Max service temperature, long Tmaxlong

260 °C

Max service temperature, short Tmaxshort

300 °C

Specific heat capacity cp

960 J/(kg·K) at 20 °C

Thermal conductivity λ

0.36 W/(m·K) at 20 °C


Dielectric constant εr

4.4 [-] at 20 °C

Electrical resistivity ρel

2.00E+15 Ω·m at 20 °C




Technological properties

Application areas

Connectors, electrical housing, switches, valves


30% Glass Fiber

Processing methods

Injection molding, extrusion

This material data has been provided by M-Base.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.