Reinforced Polyamidimide Reinforced with 30% Glass Fibre (PAI+GF30)

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It is a 30% glass fiber reinforced polyamide-imide (PAI, engineering plastic). It has high strength, elastic modulus and creep resistance. It has thermal expansion behaviour similar to aluminum and therefore excellent dimensional stability. It has the highest strength among other thermoplastics up to 275°C. It has outstanding wear, creep and chemical resistance. The machanical properties makes it a candidate for metal replacement in high temperatures and high stress applications. It has perfect electrical properties which makes it suitable for high preformance parts such as connectors and relays.

This material data has been provided by M-Base.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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1.59 - 1.61 g/cm³

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Elastic modulus

12.0 - 14.5 GPa

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2.0 - 3.0 %

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Impact strength, Charpy notched

5 kJ/m²

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Impact strength, Charpy unnotched

27 kJ/m²

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Tensile strength

205.0 - 220.0 MPa

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at 2-3% strain



Coefficient of thermal expansion

0.000016 1/K

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Specific heat capacity

960 J/(kg·K)

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Thermal conductivity

0.36 W/(m·K)

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UL 94 V0



Dielectric constant

4.4 [-]

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Electrical resistivity

2000000000000000 Ω·m

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Technological properties

Application areas

Connectors, electrical housing, switches, valves


30% Glass Fiber

Processing methods

Injection molding, extrusion